Patent Assignment Details
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| Reel/Frame: | 033047/0966 | |
| Pages: | 6 |
| | Recorded: | 06/06/2014 | | |
| Attorney Dkt #: | 95522(47762) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14363437
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Filing Dt:
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06/06/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT INTRUSION-PREVENTING LAYER AND METHOD FOR BONDING BONDED BODY
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Assignee
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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EDWARDS WILDMAN PALMER LLP
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P.O BOX 55874
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BOSTON, MA 02205
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