Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 035630/0188 | |
| Pages: | 8 |
| | Recorded: | 05/13/2015 | | |
| Attorney Dkt #: | 040302-1114 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2017
|
Application #:
|
14442570
|
Filing Dt:
|
05/13/2015
|
|
Publication #:
|
|
Pub Dt:
|
10/06/2016
| | | | |
|
Title:
|
AU-BASED SOLDER DIE ATTACHMENT SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
Assignees
|
|
|
|
|
| 2, TAKARA-CHO, KANAGAWA-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 221-0023 |
|
|
|
|
|
| 6-3, KITMO 3-CHOME |
| NIIZA-SHI, SAITAMA, JAPAN 352-8666 |
|
|
|
|
|
| 1-1, TANABESHINDEN, KAWASAKI-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
|
|
Correspondence name and address
|
| |
GLENN LAW
|
| |
FOLEY & LARDNER LLP SUITE 500
|
| |
3000 K STREET, N.W.
|
| |
WASHINGTON, DC 20007-5143
|
Search Results as of:
05/09/2024 01:52 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
