Patent Assignment Details
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| Reel/Frame: | 035948/0358 | |
| Pages: | 3 |
| | Recorded: | 06/18/2015 | | |
| Attorney Dkt #: | SALBP0301USA |
| Conveyance: | ASSIGNMENT OF PARTIAL INTEREST |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/08/2015
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Application #:
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13860705
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Filing Dt:
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04/11/2013
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Publication #:
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Pub Dt:
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10/24/2013
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Title:
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THERMAL PACKAGE WTH HEAT SLUG FOR DIE STACKS
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Assignees
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| 1-7-1 KONAN |
| MINATO-KU |
| TOKYO, JAPAN 108-0075 |
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| NYA VATTENTORNET |
| LUND, SWEDEN SE-221 88 |
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Correspondence name and address
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GRANT J. STEYER
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1621 EUCLID AVENUE, 19TH FLOOR
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CLEVELAND, OH 44115
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