Patent Assignment Details
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Reel/Frame: | 036118/0689 | |
| Pages: | 4 |
| | Recorded: | 07/17/2015 | | |
Attorney Dkt #: | 20371-136054-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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14675023
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Filing Dt:
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03/31/2015
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Publication #:
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Pub Dt:
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07/23/2015
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Title:
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Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same
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Assignee
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9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, |
TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET, SUITE 1600
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CHICAGO, IL 60603-3406
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05/13/2024 02:28 AM
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