Patent Assignment Details
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| Reel/Frame: | 036250/0418 | |
| Pages: | 5 |
| | Recorded: | 08/04/2015 | | |
| Attorney Dkt #: | Q221459 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/05/2017
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Application #:
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14817924
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Filing Dt:
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08/04/2015
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Publication #:
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Pub Dt:
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03/10/2016
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP THAT INCLUDES DIVIDING SUBSTRATE BY ETCHING GROOVE ALONG CUTTING REGION OF SUBSTRATE COMBINED WITH FORMING MODIFIED REGION BY LASER IRRADIATING ALONG CUTTING REGION IN SUBSTRATE
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Assignee
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| 7-3, AKASAKA 9-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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SUGHRUE MION PLLC
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2100 PENNSYLVANIA AVE NW
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SUITE 800
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WASHINGTON, DC 20037
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