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Reel/Frame:036402/0549   Pages: 5
Recorded: 08/24/2015
Attorney Dkt #:10829-9137.US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/29/2017
Application #:
14833608
Filing Dt:
08/24/2015
Publication #:
Pub Dt:
03/03/2016
Title:
SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS STACKED OVER SUBSTRATE
Assignors
1
Exec Dt:
08/24/2015
2
Exec Dt:
08/24/2015
Assignee
1
8000 S. FEDERAL WAY, P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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