Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 036854/0614 | |
| Pages: | 5 |
| | Recorded: | 10/22/2015 | | |
| Attorney Dkt #: | 35706-0354-00-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14919357
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Filing Dt:
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10/21/2015
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Publication #:
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Pub Dt:
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04/28/2016
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Title:
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Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Connector, Terminal, Laminate, Shield Material, Printed-Wiring Board, Metal Processed Member, Electronic Device and Method for Manufacturing the Printed Wiring Board
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Assignee
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 1008164 |
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Correspondence name and address
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DRINKER BIDDLE & REATH LLP, IP DEPT.
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ONE LOGAN SQUARE, STE. 2000
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PHILADELPHIA, PA 19103
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04/29/2024 07:43 AM
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