Patent Assignment Details
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Reel/Frame: | 037019/0730 | |
| Pages: | 9 |
| | Recorded: | 11/02/2015 | | |
Attorney Dkt #: | 036470.00050 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE 1ST ASSIGNEE ADDRESS CITY AND COUNTRY PREVIOUSLY RECORDED AT REEL: 036183 FRAME: 0798. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/02/2018
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Application #:
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14809533
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Filing Dt:
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07/27/2015
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Publication #:
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Pub Dt:
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11/19/2015
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Title:
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METHOD OF FORMING SOLDER BUMP, AND SOLDER BUMP
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Assignees
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10-1 HIGASHIKOTARI 1-CHOME |
NAGAOKAKYO-SHI, KYOTO-FU, JAPAN 617-8555 |
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23 SENJUHASHIDOCHO |
ADACHI-KU, TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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RICHARD LACAVA
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1675 BROADWAY
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ARENT FOX
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NEW YORK, NY 10019
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