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Reel/Frame:037597/0373   Pages: 7
Recorded: 01/27/2016
Attorney Dkt #:10829-9112.US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/29/2019
Application #:
15007615
Filing Dt:
01/27/2016
Publication #:
Pub Dt:
05/19/2016
Title:
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE AND ASSOCIATED SYSTEMS AND METHODS
Assignors
1
Exec Dt:
03/26/2014
2
Exec Dt:
03/21/2014
3
Exec Dt:
03/20/2014
Assignee
1
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP
P.O. BOX 1247
PATENT - SEA
SEATTLE, WA 98111-1247

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