Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 038054/0501 | |
| Pages: | 6 |
| | Recorded: | 03/21/2016 | | |
| Attorney Dkt #: | 11106/302,/449,/454,/460 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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05/14/2013
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Application #:
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12759417
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Filing Dt:
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04/13/2010
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Publication #:
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Pub Dt:
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11/18/2010
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Title:
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ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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06/11/2013
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Application #:
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13114415
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Filing Dt:
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05/24/2011
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Publication #:
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Pub Dt:
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09/15/2011
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Title:
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WAFER AND PACKAGE PRODUCT MANUFACTURING METHOD
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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13163096
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Filing Dt:
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06/17/2011
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Publication #:
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Pub Dt:
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10/13/2011
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Title:
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GLASS SUBSTRATE POLISHING METHOD, PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13177898
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Filing Dt:
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07/07/2011
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Publication #:
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Pub Dt:
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10/27/2011
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Title:
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Method of Manufacturing Packages
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Assignee
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| 8, NAKASE 1-CHOME, MIHAMA-KU |
| CHIBA-SHI, CHIBA, JAPAN 261-8507 |
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Correspondence name and address
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TADASHI HORIE/KOH HINOKAWA
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P.O. BOX 10395
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CHICAGO, IL 60610
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