Patent Assignment Details
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| Reel/Frame: | 039800/0334 | |
| Pages: | 3 |
| | Recorded: | 08/30/2016 | | |
| Attorney Dkt #: | SLA0598 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ISSUE DATE INSIDE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 039012 FRAME: 0888. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2002
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Application #:
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09894941
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Filing Dt:
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06/28/2001
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Title:
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METHODS OF USING ATOMIC LAYER DEPOSITION TO DEPOSIT A HIGH DIELECTRIC CONSTANT MATERIAL ON A SUBSTRATE
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Assignee
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| 1 TAKUMI-CHO, SAKAI-KU |
| SAKAI CITY, OSAKA, JAPAN 590-8522 |
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Correspondence name and address
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DAVID C. RIPMA
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SHARP LABORATORIES OF AMERICA, INC.
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5750 NW PACIFIC RIM BLVD.
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CAMAS, WA 98607
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