Patent Assignment Details
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| Reel/Frame: | 040106/0869 | |
| Pages: | 3 |
| | Recorded: | 10/24/2016 | | |
| Attorney Dkt #: | 52311-US-1134-PCT(CA) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15241086
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Filing Dt:
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08/19/2016
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Publication #:
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Pub Dt:
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12/08/2016
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Title:
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BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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Assignee
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| 51-1 INADAIRA 2-CHOME, |
| MUSASHIMURAYAMA-SHI, |
| TOKYO, JAPAN 208-8585 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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