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Reel/Frame:041160/0081   Pages: 5
Recorded: 02/02/2017
Attorney Dkt #:THP-DNP-17003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/26/2018
Application #:
15422990
Filing Dt:
02/02/2017
Publication #:
Pub Dt:
05/25/2017
Title:
THROUGH-ELECTRODE SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE IN WHICH THROUGH-ELECTRODE SUBSTRATE IS USED
Assignor
1
Exec Dt:
01/25/2017
Assignee
1
1-1-1, ICHIGAYA KAGACHO, SHINJUKU-KU
TOKYO, JAPAN 1628001
Correspondence name and address
TYPHA IP LLC
1819 L STREET NW SUITE 200
WASHINGTON, DC 20036

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