Patent Assignment Details
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| Reel/Frame: | 042797/0246 | |
| Pages: | 4 |
| | Recorded: | 06/23/2017 | | |
| Attorney Dkt #: | 474892US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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09/06/2016
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Application #:
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14518389
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Filing Dt:
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10/20/2014
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Publication #:
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Pub Dt:
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06/11/2015
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION LAYER.
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15230125
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Filing Dt:
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08/05/2016
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Publication #:
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Pub Dt:
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11/24/2016
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Title:
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SEMICONDUCTOR DEVICE FOR BONDING CONDUCTIVE LAYERS EXPOSED FROM SURFACES OF RESPECTIVE INTERCONNECTION LAYERS
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Assignee
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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Correspondence name and address
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OBLON, ET AL.
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1940 DUKE STREET
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ALEXANDRIA, VA 22314
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