Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 042874/0811 | |
| Pages: | 3 |
| | Recorded: | 06/16/2017 | | |
| Attorney Dkt #: | 15262395-000001-002 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/12/2019
|
Application #:
|
15534196
|
Filing Dt:
|
06/08/2017
|
|
Publication #:
|
|
Pub Dt:
|
04/19/2018
| | | | |
|
Title:
|
WAFER DE-BONDING DEVICE
|
|
|
Assignee
|
|
|
|
|
| BUILDING 14-108, 818 QIMING ROAD |
| YINZHOU DISTRICT, NINGBO CITY |
| ZHEJIANG, CHINA 315100 |
|
|
Correspondence name and address
|
| |
DENTONS US LLP - PETER SU
|
| |
1530 PAGE MILL ROAD
|
| |
SUITE 200
|
| |
PALO ALTO, CA 94304
|
Search Results as of:
05/15/2024 05:10 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
