Patent Assignment Details
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| Reel/Frame: | 043269/0668 | |
| Pages: | 4 |
| | Recorded: | 08/11/2017 | | |
| Attorney Dkt #: | 1170 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/26/2017
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Application #:
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14314043
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Filing Dt:
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06/25/2014
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Publication #:
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Pub Dt:
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11/06/2014
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Title:
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LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART
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Assignee
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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Correspondence name and address
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MICHAEL TOBIAS
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1629 K STREET NW
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SUITE 300
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WASHINGTON, DC 20006
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