Patent Assignment Details
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| Reel/Frame: | 043426/0918 | |
| Pages: | 2 |
| | Recorded: | 08/28/2017 | | |
| Attorney Dkt #: | 17334 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/28/2019
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Application #:
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15688631
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Filing Dt:
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08/28/2017
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Publication #:
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Pub Dt:
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12/14/2017
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Title:
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MOLDED INTERCONNECT DEVICE, MANUFACTURING METHOD FOR MOLDED INTERCONNECT DEVICE, AND CIRCUIT MODULE
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Assignee
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| 2951, ISHIKAWA-MACHI |
| HACHIOJI-SHI |
| TOKYO, JAPAN 192-8507 |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036-3744
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