Patent Assignment Details
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| Reel/Frame: | 044110/0415 | |
| Pages: | 3 |
| | Recorded: | 11/13/2017 | | |
| Attorney Dkt #: | P/4227-101 CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/12/2019
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Application #:
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15810932
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Filing Dt:
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11/13/2017
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Publication #:
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Pub Dt:
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03/08/2018
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Title:
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SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
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Assignees
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| 3-6-3, HIGASHINAKANO, NAKANO-KU |
| TOKYO, JAPAN 164-0003 |
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| 77, ISHIHARANISHIMACHI, KISSHOIN |
| MINAMI-KU, KYOTO-SHI |
| KYOTO, JAPAN 601-8366 |
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Correspondence name and address
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OSTROLENK FABER LLP
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1180 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036-8403
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