Patent Assignment Details
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Reel/Frame: | 044475/0514 | |
| Pages: | 4 |
| | Recorded: | 12/25/2017 | | |
Attorney Dkt #: | 70138-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/29/2019
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Application #:
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15849593
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Filing Dt:
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12/20/2017
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignees
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NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, |
HSINCHU, TAIWAN 31040 |
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RM.417, BLDG. 52, NO. 195, SEC. 4, CHUNG-HSING RD., CHU-TUNG, |
HSINCHU, TAIWAN |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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