Patent Assignment Details
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| Reel/Frame: | 045799/0679 | |
| Pages: | 4 |
| | Recorded: | 05/14/2018 | | |
| Attorney Dkt #: | SUND-1824C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/02/2020
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Application #:
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15979403
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Filing Dt:
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05/14/2018
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Publication #:
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Pub Dt:
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09/13/2018
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignees
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| NO. 195, SEC. 4, CHUNG HSING ROAD, CHUTUNG |
| HSINCHU, TAIWAN 31040 |
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| 5F.-4, NO.502, YUANSHAN RD., ZHONGHE DIST. |
| NEW TAIPEI CITY, TAIWAN 235 |
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Correspondence name and address
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RABIN & BERDO, P.C.
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1101 14TH ST., N.W., SUITE 500
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WASHINGTON, DC 20005
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