Patent Assignment Details
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Reel/Frame: | 046283/0553 | |
| Pages: | 5 |
| | Recorded: | 07/06/2018 | | |
Attorney Dkt #: | MI22-6503 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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16029144
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Filing Dt:
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07/06/2018
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Title:
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Integrated Assemblies Having Thicker Semiconductor Material Along One Region of a Conductive Structure than Along Another Region
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Assignee
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8000 SOUTH FEDERAL WAY |
MS 1-525 |
BOISE, IDAHO 83716 |
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Correspondence name and address
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WELLS ST. JOHN, P.S.
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601 W. MAIN AVENUE
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SUITE 600
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SPOKANE, WA 99201
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