Patent Assignment Details
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| Reel/Frame: | 047482/0348 | |
| Pages: | 3 |
| | Recorded: | 11/13/2018 | | |
| Attorney Dkt #: | TOR-328US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16186676
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Filing Dt:
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11/12/2018
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Publication #:
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Pub Dt:
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03/14/2019
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Title:
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ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION
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Assignee
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 1038666 |
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Correspondence name and address
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RATNERPRESTIA
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2200 RENAISSANCE BLVD
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SUITE 350
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KING OF PRUSSIA, PA 19406
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