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Reel/Frame:047605/0515   Pages: 4
Recorded: 11/28/2018
Attorney Dkt #:0941-3880PUS1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
16201268
Filing Dt:
11/27/2018
Publication #:
Pub Dt:
03/26/2020
Title:
ENCAPSULATION MATERIAL AND MODULE STRUCTURE
Assignors
1
Exec Dt:
10/24/2018
2
Exec Dt:
10/30/2018
3
Exec Dt:
10/24/2018
4
Exec Dt:
10/29/2018
5
Exec Dt:
10/25/2018
6
Exec Dt:
10/25/2018
7
Exec Dt:
10/25/2018
Assignee
1
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG
HSINCHU, TAIWAN 31040
Correspondence name and address
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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