Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 047841/0020 | |
| Pages: | 13 |
| | Recorded: | 12/21/2018 | | |
| Attorney Dkt #: | 010829-9070.US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2020
|
Application #:
|
16229257
|
Filing Dt:
|
12/21/2018
|
|
Publication #:
|
|
Pub Dt:
|
04/25/2019
| | | | |
|
Title:
|
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AND ASSOCIATED SYSTEMS AND METHODS
|
|
|
Assignee
|
|
|
|
|
| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
|
|
Correspondence name and address
|
| |
PERKINS COIE LLP - MICRON PATENT-SEA
|
| |
PO BOX 1247
|
| |
SEATTLE, WA 98111-1247
|
Search Results as of:
05/12/2024 07:36 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
