Patent Assignment Details
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| Reel/Frame: | 049321/0404 | |
| Pages: | 5 |
| | Recorded: | 05/30/2019 | | |
| Attorney Dkt #: | 3531.135350 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/08/2022
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Application #:
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16359059
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Filing Dt:
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03/20/2019
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Publication #:
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Pub Dt:
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09/26/2019
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Title:
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WAFER GRINDING METHOD
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Assignees
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| 1, TOYOTA-CHO, |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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| 13-11, OMORI-KITA 2-CHOME, OTA-KU, |
| TOKYO, JAPAN 143-8580 |
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Correspondence name and address
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GREER BURNS & CRAIN LTD
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300 S. WACKER DR.
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SUITE 2500
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CHICAGO, IL 60606
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