Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050441/0158 | |
| Pages: | 6 |
| | Recorded: | 09/19/2019 | | |
| Attorney Dkt #: | M279.8200A01 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 050370 FRAME: 0773. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
4
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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10478649
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Filing Dt:
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01/23/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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PRODUCTION METHOD OF ALPHA-SIC WAFER
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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10520141
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Title:
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LARGE-DIAMETER SIC WAFER AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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10/23/2012
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Application #:
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12602559
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Filing Dt:
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12/01/2009
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Publication #:
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Pub Dt:
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08/26/2010
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Title:
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METHOD FOR PRODUCTION OF SUBSTRATE ELECTRODE FOR PLASMA PROCESSING
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Patent #:
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Issue Dt:
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08/13/2013
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Application #:
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13808556
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Filing Dt:
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01/04/2013
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Publication #:
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Pub Dt:
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05/09/2013
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Title:
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SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE, AND SOI WAFER
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Assignee
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| 2-3-4 NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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Correspondence name and address
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DAVID BRUSH
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900 SECOND AVENUE SOUTH
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SUITE 1400
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MINNEAPOLIS, MN 55402
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