Patent Assignment Details
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| Reel/Frame: | 051261/0851 | |
| Pages: | 6 |
| | Recorded: | 12/12/2019 | | |
| Attorney Dkt #: | 074128-0219 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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16711047
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Filing Dt:
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12/11/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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SEMICONDUCTOR IC-EMBEDDED SUBSTRATE HAVING HEAT DISSIPATION STRUCTURE AND ITS MANUFACTURING METHOD
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Assignee
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| 2-5-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-6128 |
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Correspondence name and address
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TOMOKI TANIDA
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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