Patent Assignment Details
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Reel/Frame: | 051382/0258 | |
| Pages: | 6 |
| | Recorded: | 12/28/2019 | | |
Attorney Dkt #: | 074128-0205 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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16550995
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Filing Dt:
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08/26/2019
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Title:
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SENSOR PACKAGE SUBSTRATE, SENSOR MODULE INCLUDING THE SAME, AND ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
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Assignee
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2-5-1, NIHONBASHI, CHUO-KU |
TOKYO, JAPAN 103-6128 |
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Correspondence name and address
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TOMOKI TANIDA
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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05/02/2024 03:45 PM
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