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Reel/Frame:053242/0422   Pages: 16
Recorded: 07/17/2020
Attorney Dkt #:MISC
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 14
1
Patent #:
9635762
Issue Dt:
04/25/2017
Application #:
14803889
Filing Dt:
07/20/2015
Publication #:
US20160027715
Pub Dt:
01/28/2016
Title:
SEMICONDUCTOR PACKAGE
2
Patent #:
9368474
Issue Dt:
06/14/2016
Application #:
14850589
Filing Dt:
09/10/2015
Publication #:
US20160079204
Pub Dt:
03/17/2016
Title:
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
3
Patent #:
9905536
Issue Dt:
02/27/2018
Application #:
14994963
Filing Dt:
01/13/2016
Publication #:
US20160218086
Pub Dt:
07/28/2016
Title:
SEMICONDUCTOR DEVICE
4
Patent #:
9595488
Issue Dt:
03/14/2017
Application #:
15010988
Filing Dt:
01/29/2016
Publication #:
US20160225701
Pub Dt:
08/04/2016
Title:
SEMICONDUCTOR DEVICE
5
Patent #:
10388625
Issue Dt:
08/20/2019
Application #:
15290557
Filing Dt:
10/11/2016
Publication #:
US20170110432
Pub Dt:
04/20/2017
Title:
PRESS FITTING HEAD AND SEMICONDUCTOR MANUFACTURING APPARATUS USING THE SAME
6
Patent #:
9721900
Issue Dt:
08/01/2017
Application #:
15364851
Filing Dt:
11/30/2016
Publication #:
US20170170123
Pub Dt:
06/15/2017
Title:
SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
7
Patent #:
NONE
Issue Dt:
Application #:
15366064
Filing Dt:
12/01/2016
Publication #:
US20170170106
Pub Dt:
06/15/2017
Title:
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOF
8
Patent #:
10062638
Issue Dt:
08/28/2018
Application #:
15446426
Filing Dt:
03/01/2017
Publication #:
US20170263537
Pub Dt:
09/14/2017
Title:
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
9
Patent #:
10553456
Issue Dt:
02/04/2020
Application #:
15472387
Filing Dt:
03/29/2017
Publication #:
US20170316996
Pub Dt:
11/02/2017
Title:
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
10
Patent #:
10096564
Issue Dt:
10/09/2018
Application #:
15481848
Filing Dt:
04/07/2017
Publication #:
US20170317045
Pub Dt:
11/02/2017
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
11
Patent #:
10529635
Issue Dt:
01/07/2020
Application #:
15493231
Filing Dt:
04/21/2017
Publication #:
US20170316998
Pub Dt:
11/02/2017
Title:
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE INCLUDING LASER PROCESSING
12
Patent #:
10559523
Issue Dt:
02/11/2020
Application #:
16053965
Filing Dt:
08/03/2018
Publication #:
US20180342443
Pub Dt:
11/29/2018
Title:
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
13
Patent #:
11189553
Issue Dt:
11/30/2021
Application #:
16661952
Filing Dt:
10/23/2019
Publication #:
US20200066623
Pub Dt:
02/27/2020
Title:
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREOF
14
Patent #:
11322431
Issue Dt:
05/03/2022
Application #:
16745920
Filing Dt:
01/17/2020
Publication #:
US20200152555
Pub Dt:
05/14/2020
Title:
SEMICONDUCTOR DEVICE HAVING OUTER TERMINAL PORTIONS WITH CONDUCTIVE LAYER ON OUTER END SURFACES AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Assignor
1
J-DEVICES CORPORATION
Exec Dt:
01/01/2020
Assignee
1
AMKOR TECHNOLOGY JAPAN, INC.
1913-2, TAKEGASHITA FUKURA
USUKI-SHI, OITA, JAPAN 875-0053
Correspondence name and address
LAW OFFICE OF KEVIN B. JACKSON
6315 E CACTUS WREN RD
PARADISE VALLEY, AZ 85253-8006

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