Patent Assignment Details
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| Reel/Frame: | 053463/0182 | |
| Pages: | 8 |
| | Recorded: | 08/11/2020 | | |
| Attorney Dkt #: | 010829-9448.US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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16990943
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Filing Dt:
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08/11/2020
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Title:
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THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
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Assignee
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| 8000 S. FEDERAL WAY, P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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04/27/2024 07:02 PM
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