Patent Assignment Details
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| Reel/Frame: | 054562/0014 | |
| Pages: | 6 |
| | Recorded: | 12/07/2020 | | |
| Attorney Dkt #: | 180688US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17088136
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Filing Dt:
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11/03/2020
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Publication #:
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Pub Dt:
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05/20/2021
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Title:
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SPLIT ASH PROCESSES FOR VIA FORMATION TO SUPPRESS DAMAGE TO LOW-K LAYERS
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Assignee
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| AKASAKA BIZ TOWER |
| 3-1 AKASAKA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-6325 |
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Correspondence name and address
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TOKYO ELECTRON U.S. HOLDINGS, INC.
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2400 GROVE BLVD.
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AUSTIN, TX 78741
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05/10/2024 03:56 PM
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