Patent Assignment Details
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Reel/Frame: | 054583/0852 | |
| Pages: | 4 |
| | Recorded: | 12/08/2020 | | |
Attorney Dkt #: | 010829-9398.US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/30/2023
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Application #:
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17115716
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Filing Dt:
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12/08/2020
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Publication #:
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Pub Dt:
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03/25/2021
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Title:
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SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS AND METHODS OF MANUFACTURING THE SAME
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Assignee
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8000 S. FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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05/13/2024 03:12 AM
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