Patent Assignment Details
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| Reel/Frame: | 055006/0770 | |
| Pages: | 7 |
| | Recorded: | 01/22/2021 | | |
| Attorney Dkt #: | 4287-005.PCT.US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17262678
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Filing Dt:
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01/22/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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Conductive Circuit-Attached Molded Product and Manufacturing Method for the Same, and Conductive Circuit-Attached Preform and Manufacturing Method for the Same
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Assignee
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| 3, MIBU HANAI-CHO, NAKAGYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 604-8551 |
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Correspondence name and address
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THORPE NORTH & WESTERN
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8180 S. 700 E., SUITE 350
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SANDY, UT 84070
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