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Reel/Frame:055888/0617   Pages: 5
Recorded: 04/12/2021
Attorney Dkt #:010829-9248.US03
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/09/2024
Application #:
17227525
Filing Dt:
04/12/2021
Publication #:
Pub Dt:
08/19/2021
Title:
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
Assignors
1
Exec Dt:
11/16/2017
2
Exec Dt:
11/16/2017
Assignee
1
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, 98111-1247 UNITED STATES

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