Patent Assignment Details
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| Reel/Frame: | 056582/0487 | |
| Pages: | 3 |
| | Recorded: | 06/18/2021 | | |
| Attorney Dkt #: | 753146 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17272204
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Filing Dt:
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02/26/2021
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Publication #:
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Pub Dt:
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11/04/2021
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Title:
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MEDIUM COMPOSITION FOR SUSPENSION CULTURE OF ADHESIVE CELLS
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Assignee
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| 5-1, NIHONBASHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-6119 |
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Correspondence name and address
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JOHN KILYK, JR.
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LEYDIG, VOIT & MAYER, LTD.
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TWO PRUDENTIAL PLAZA, SUITE 4900
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CHICAGO, IL 60601-6731
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