Patent Assignment Details
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| Reel/Frame: | 056588/0551 | |
| Pages: | 5 |
| | Recorded: | 06/18/2021 | | |
| Attorney Dkt #: | 4554-590 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17415897
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Filing Dt:
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06/18/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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BONDING LAYER EVALUATION SYSTEM AND BONDING LAYER EVALUATION METHOD
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Assignees
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8332 |
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| 36-1, YOSHIDA-HONMACHI, SAKYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 606-8501 |
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| 8, NISHINOKYO-HIGASHI-TOGANO-CHO, NAKAGYO-KU, KYOTO-SHI |
| KYOTO, JAPAN 604-8520 |
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Correspondence name and address
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BENJAMIN J. HAUPTMAN
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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