Patent Assignment Details
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| Reel/Frame: | 056904/0730 | |
| Pages: | 3 |
| | Recorded: | 07/19/2021 | | |
| Attorney Dkt #: | 010829-9551.US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/14/2023
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Application #:
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17379568
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Filing Dt:
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07/19/2021
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFACTURING
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Assignee
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| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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04/28/2024 10:48 AM
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