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Reel/Frame:057255/0442   Pages: 5
Recorded: 08/23/2021
Attorney Dkt #:81052502
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17427670
Filing Dt:
08/02/2021
Publication #:
Pub Dt:
05/26/2022
Title:
POLYIMIDE COMPOUND AND MOLDED ARTICLE COMPRISING THE POLYIMIDE COMPOUND
Assignors
1
Exec Dt:
08/16/2021
2
Exec Dt:
08/16/2021
Assignee
1
OKAYAMA RESEARCH PARK INCUBATION CENTER 115, 5303, HAGA, KITA-KU
OKAYAMA-SHI, OKAYAMA-KEN, JAPAN 7011221
Correspondence name and address
ELEMENT IP, PLC
2331 MILL ROAD
SUITE 610
ALEXANDRIA, VA 22314

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