Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057311/0001 | |
| Pages: | 6 |
| | Recorded: | 08/27/2021 | | |
| Attorney Dkt #: | 252056-1650 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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05/21/2024
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Application #:
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17459266
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Filing Dt:
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08/27/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Title:
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CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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MCCLURE, QUALEY & RODACK LLP
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280 INTERSTATE NORTH CIRCLE
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SUITE 550
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ATLANTA, GA 30339
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05/20/2024 10:56 AM
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