Patent Assignment Details
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| Reel/Frame: | 057756/0888 | |
| Pages: | 5 |
| | Recorded: | 10/11/2021 | | |
| Attorney Dkt #: | JCGL115651-PCT(CA) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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17496756
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Filing Dt:
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10/07/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Title:
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METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER
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Assignees
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| 475-2, TSURUTA, MOOKA-SHI, |
| TOCHIGI, JAPAN 3214302 |
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| 4-15-4, CHUO, WARABI-SHI, |
| SAITAMA, JAPAN 3350004 |
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| 6-11-10, MORI, ISOGO-KU, YOKOHAMA-SHI, |
| KANAGAWA, JAPAN 2350023 |
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Correspondence name and address
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JCIP GLOBAL INC.
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20 PACIFICA, SUITE 220
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IRVINE, CA 92618
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