Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 058041/0290 | |
| Pages: | 12 |
| | Recorded: | 11/08/2021 | | |
Attorney Dkt #: | 20371-153299-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2024
|
Application #:
|
17600463
|
Filing Dt:
|
09/30/2021
|
Publication #:
|
|
Pub Dt:
|
06/02/2022
| | | | |
Title:
|
RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
|
|
Assignee
|
|
|
9-2, MARUNOUCHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-6606 |
|
Correspondence name and address
|
|
ALAN E. SCHIAVELLI
|
|
1250 23RD STREET NW, SUITE 410
|
|
WASHINGTON,, DC 20037-1164
|
Search Results as of:
05/09/2024 08:46 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|