Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058474/0112 | |
| Pages: | 5 |
| | Recorded: | 12/23/2021 | | |
| Attorney Dkt #: | 5127-0061 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17561360
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Filing Dt:
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12/23/2021
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Publication #:
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Pub Dt:
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06/30/2022
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Title:
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MEDIUM HAVING HEAT-SENSITIVE MEDIUM AND ADHESIVE MEDIUM WHOSE WIDTH IS GREATER THAN WIDTH OF HEAT-SENSITIVE MEDIUM, CARTRIDGE INCLUDING THE MEDIUM, AND METHOD FOR CREATING THE MEDIUM
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Assignee
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| 15-1 NAESHIRO-CHO, MIZUHO-KU |
| NAGOYA, JAPAN 467-8561 |
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Correspondence name and address
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KENEALY VAIDYA LLP
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3050 K STREET, N.W.
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SUITE 302
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WASHINGTON, DC 20007
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