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Reel/Frame:058481/0093   Pages: 5
Recorded: 12/27/2021
Attorney Dkt #:010829-9470.US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17562290
Filing Dt:
12/27/2021
Publication #:
Pub Dt:
04/21/2022
Title:
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME
Assignors
1
Exec Dt:
07/15/2020
2
Exec Dt:
07/06/2020
Assignee
1
8000 S. FEDERAL WAY
P.O. BOX 6
BOISE, IDAHO 83707-0006
Correspondence name and address
PERKINS COIE LLP - MICRON PATENT-SEA
PO BOX 1247
SEATTLE, WA 98111-1247

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