Patent Assignment Details
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| Reel/Frame: | 058737/0415 | |
| Pages: | 97 |
| | Recorded: | 01/14/2022 | | |
| Attorney Dkt #: | 17361C1C1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16831568
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Filing Dt:
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03/26/2020
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Publication #:
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Pub Dt:
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07/16/2020
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Title:
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SEMICONDUCTOR MEMORY DEVICE HAVING BONDED FIRST AND SECOND SEMICONDUCTOR CHIPS PROVIDED WITH RESPECTIVE IMPEDANCE CALIBRATION CONTROL CIRCUITS
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Assignee
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| 1-21, SHIBAURA 3-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVE
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SUITE 1010
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NEW YORK, NY 10036
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