Patent Assignment Details
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| Reel/Frame: | 060657/0514 | |
| Pages: | 7 |
| | Recorded: | 07/28/2022 | | |
| Attorney Dkt #: | 22YS-003 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17759650
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Filing Dt:
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07/28/2022
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Publication #:
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Pub Dt:
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03/16/2023
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Title:
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CONNECTION STRUCTURE BETWEEN PARTITION WALLS AND FLOOR SLAB, AND METHOD FOR CONSTRUCTING SAME
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Assignee
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| SHIN-TOKYO BLDG., 3-1, MARUNOUCHI 3-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 100-0005 |
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Correspondence name and address
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IPUSA, P.L.L.C
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1054 31ST STREET, N.W.
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SUITE 400
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WASHINGTON, DC 20007
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