Patent Assignment Details
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Reel/Frame: | 061328/0500 | |
| Pages: | 16 |
| | Recorded: | 10/06/2022 | | |
Attorney Dkt #: | TSLC/SE 2019-002.03CIP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17879834
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Filing Dt:
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08/03/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving Plate
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Assignees
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1F, NO. 11, KE JUNG RD. CHU-NAN SITE |
HSINCHU SCIENCE PARK, MIAO-LI COUNTY |
CHU-NAN, TAIWAN 350 |
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MARUNOUCHI EIRAKU BLDG. 4-1 MARUNOUCHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 100-0005 |
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Correspondence name and address
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STEPHEN A. GRATTON
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2764 SOUTH BRAUN WAY
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LAKEWOOD, CO 80228
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05/09/2024 07:46 AM
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