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Reel/Frame:061334/0108   Pages: 5
Recorded: 10/06/2022
Attorney Dkt #:2022-1827A
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17917313
Filing Dt:
10/06/2022
Publication #:
Pub Dt:
05/18/2023
Title:
COPOLYMERIZED POLYESTER RESIN, MOLDED PRODUCT, HEAT-SHRINKABLE FILM, AND FIBER
Assignors
1
Exec Dt:
08/24/2022
2
Exec Dt:
08/29/2022
Assignee
1
13-1, UMEDA 1-CHOME, KITA-KU, OSAKA-SHI
OSAKA, JAPAN 530-0001
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
1025 CONNECTICUT AVENUE, N.W.
SUITE 500
WASHINGTON, DC 20036

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