|
Total properties:
54
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2023
|
Application #:
|
17810745
|
Filing Dt:
|
07/05/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2023
| | | | |
|
Title:
|
WIDE VOLTAGE RANGE LEVEL SHIFTER CIRCUIT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17811009
|
Filing Dt:
|
07/06/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/11/2024
| | | | |
|
Title:
|
DIGITAL COMMUNICATIONS BUS SUITABLE FOR AUTOMOTIVE APPLICATIONS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17811149
|
Filing Dt:
|
07/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/11/2024
| | | | |
|
Title:
|
SPAD-BASED DEVICES WITH TRANSISTOR STACKING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17811618
|
Filing Dt:
|
07/11/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/11/2024
| | | | |
|
Title:
|
DIODES WITH SCHOTTKY CONTACT INCLUDING LOCALIZED SURFACE REGIONS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17813348
|
Filing Dt:
|
07/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2022
| | | | |
|
Title:
|
DIE SIDEWALL COATINGS AND RELATED METHODS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2024
|
Application #:
|
17813351
|
Filing Dt:
|
07/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2022
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGES WITH DIE SUPPORT STRUCTURE FOR THIN DIE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17813357
|
Filing Dt:
|
07/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2022
| | | | |
|
Title:
|
MULTIDIE SUPPORTS AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17813380
|
Filing Dt:
|
07/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2024
| | | | |
|
Title:
|
DUAL SIDE COOLED POWER MODULE WITH THREE-DIMENSIONAL DIRECT BONDED METAL SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/31/2023
|
Application #:
|
17813868
|
Filing Dt:
|
07/20/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2022
| | | | |
|
Title:
|
IMAGE SENSORS HAVING HIGH DYNAMIC RANGE IMAGING PIXELS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17813872
|
Filing Dt:
|
07/20/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/03/2022
| | | | |
|
Title:
|
SILICON PHOTOMULTIPLIERS WITH SPLIT MICROCELLS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17813972
|
Filing Dt:
|
07/21/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2024
| | | | |
|
Title:
|
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17814566
|
Filing Dt:
|
07/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2024
| | | | |
|
Title:
|
HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17814750
|
Filing Dt:
|
07/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/10/2022
| | | | |
|
Title:
|
POWER DEVICE INCLUDING METAL LAYER
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17814949
|
Filing Dt:
|
07/26/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2024
| | | | |
|
Title:
|
DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17815984
|
Filing Dt:
|
07/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2024
| | | | |
|
Title:
|
MONITORING TEMPERATURE PER PHASE IN A MULTIPHASE POWER STAGE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17815995
|
Filing Dt:
|
07/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/01/2024
| | | | |
|
Title:
|
ADDRESSING MULTIPHASE POWER STAGE MODULES FOR POWER STATE AND THERMAL MANAGEMENT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17816144
|
Filing Dt:
|
07/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2022
| | | | |
|
Title:
|
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/16/2024
|
Application #:
|
17816224
|
Filing Dt:
|
07/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2022
| | | | |
|
Title:
|
STITCHED INTEGRATED CIRCUIT DIES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17816450
|
Filing Dt:
|
08/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/17/2022
| | | | |
|
Title:
|
MULTICHIP MODULE SUPPORTS AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17816455
|
Filing Dt:
|
08/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
11/24/2022
| | | | |
|
Title:
|
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17816797
|
Filing Dt:
|
08/02/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/26/2023
| | | | |
|
Title:
|
IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17817082
|
Filing Dt:
|
08/03/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2023
| | | | |
|
Title:
|
DYNAMIC ANTENNA TUNING APPARATUS AND METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17817116
|
Filing Dt:
|
08/03/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2023
| | | | |
|
Title:
|
SELF CLOCKED LOW POWER DOUBLING CHARGE PUMP
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17817736
|
Filing Dt:
|
08/05/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/16/2023
| | | | |
|
Title:
|
POWER CIRCUIT MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/08/2023
|
Application #:
|
17818436
|
Filing Dt:
|
08/09/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/01/2022
| | | | |
|
Title:
|
IMAGING SYSTEMS WITH ADJUSTABLE AMPLIFIER CIRCUITRY
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17818880
|
Filing Dt:
|
08/10/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/15/2024
| | | | |
|
Title:
|
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17819469
|
Filing Dt:
|
08/12/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/15/2024
| | | | |
|
Title:
|
ADJUSTABLE CLAMP FINGER DESIGN
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/19/2024
|
Application #:
|
17820007
|
Filing Dt:
|
08/16/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2023
| | | | |
|
Title:
|
APPARATUS AND METHODS FOR PRODUCING STABLE CLOCK SIGNALS BASED ON A VARYING FREQUENCY SOURCE CLOCK
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17820960
|
Filing Dt:
|
08/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2023
| | | | |
|
Title:
|
SENSOR READOUT CIRCUIT AND METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17821052
|
Filing Dt:
|
08/19/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/22/2022
| | | | |
|
Title:
|
METHODS AND APPARATUS FOR AN IMAGE SENSOR
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/14/2024
|
Application #:
|
17821497
|
Filing Dt:
|
08/23/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Title:
|
MOTION-COMPENSATED DISTANCE SENSING WITH CONCURRENT UP-CHIRP DOWN-CHIRP WAVEFORMS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17821986
|
Filing Dt:
|
08/24/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Title:
|
BATTERY HAZARD DETECTION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822008
|
Filing Dt:
|
08/24/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Title:
|
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822329
|
Filing Dt:
|
08/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Title:
|
CYCLIC REDUNDANCY CHECK (CRC) GENERATION
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822403
|
Filing Dt:
|
08/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Title:
|
IMAGE SENSOR BALL GRID ARRAY PACKAGE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822405
|
Filing Dt:
|
08/25/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/02/2023
| | | | |
|
Title:
|
SIDEWALL PROTECTED IMAGE SENSOR PACKAGE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822604
|
Filing Dt:
|
08/26/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/29/2024
| | | | |
|
Title:
|
INDUCTIVE ANGULAR POSITION SENSOR
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/19/2023
|
Application #:
|
17822844
|
Filing Dt:
|
08/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/22/2022
| | | | |
|
Title:
|
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17822852
|
Filing Dt:
|
08/29/2022
|
|
Publication #:
|
|
Pub Dt:
|
10/05/2023
| | | | |
|
Title:
|
SYNCHRONOUS RECTIFICATION CONTROL IN LLC TOPOLOGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2024
|
Application #:
|
17823149
|
Filing Dt:
|
08/30/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2024
|
Application #:
|
17823164
|
Filing Dt:
|
08/30/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2024
|
Application #:
|
17823209
|
Filing Dt:
|
08/30/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
TERMINATION OF WIRELESS TRANSMISSION OF A DATA FRAME
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
05/28/2024
|
Application #:
|
17929258
|
Filing Dt:
|
09/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2023
| | | | |
|
Title:
|
METHODS AND STRUCTURES FOR CONTACTING SHIELD CONDUCTOR IN A SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/02/2024
|
Application #:
|
17929884
|
Filing Dt:
|
09/06/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2024
|
Application #:
|
17929898
|
Filing Dt:
|
09/06/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/14/2023
|
Application #:
|
17930081
|
Filing Dt:
|
09/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2023
| | | | |
|
Title:
|
SYSTEMS AND METHODS FOR DESIGNING A MODULE SEMICONDUCTOR PRODUCT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2024
|
Application #:
|
17930091
|
Filing Dt:
|
09/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2023
| | | | |
|
Title:
|
SYSTEMS AND METHODS FOR DESIGNING A DISCRETE DEVICE PRODUCT
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17930111
|
Filing Dt:
|
09/07/2022
|
|
Publication #:
|
|
Pub Dt:
|
12/29/2022
| | | | |
|
Title:
|
IMAGE SENSOR PACKAGES AND RELATED METHODS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17931665
|
Filing Dt:
|
09/13/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/14/2024
| | | | |
|
Title:
|
POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2024
|
Application #:
|
17931747
|
Filing Dt:
|
09/13/2022
|
|
Publication #:
|
|
Pub Dt:
|
01/05/2023
| | | | |
|
Title:
|
LOW-LATENCY COMMUNICATION PROTOCOL FOR BINAURAL APPLICATIONS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17931770
|
Filing Dt:
|
09/13/2022
|
|
Publication #:
|
|
Pub Dt:
|
02/23/2023
| | | | |
|
Title:
|
SIC MOSFET WITH BUILT-IN SCHOTTKY DIODE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17931947
|
Filing Dt:
|
09/14/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/14/2024
| | | | |
|
Title:
|
SLEW-RATE BOOST CIRCUITRY
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17933935
|
Filing Dt:
|
09/21/2022
|
|
Publication #:
|
|
Pub Dt:
|
03/21/2024
| | | | |
|
Title:
|
BOOTSTRAP CLAMP CIRCUIT AND METHOD
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17935967
|
Filing Dt:
|
09/28/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/14/2023
| | | | |
|
Title:
|
BANDGAP CIRCUIT WITH NOISE REDUCTION AND TEMPERATURE STABILITY
|
|
