Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 063040/0001 | |
| Pages: | 12 |
| | Recorded: | 03/10/2023 | | |
| Attorney Dkt #: | 01544GEN |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
11
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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16486355
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Filing Dt:
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08/15/2019
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Publication #:
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Pub Dt:
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07/30/2020
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Title:
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POLYAMIDEIMIDE RESIN COMPOSITION AND FLOURINE-BASED COATING MATERIAL
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16489401
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Filing Dt:
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08/28/2019
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Publication #:
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Pub Dt:
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12/19/2019
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Title:
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POLYAMIDEIMIDE RESIN AND USE THEREOF
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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16767908
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Filing Dt:
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05/28/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17260138
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Filing Dt:
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01/13/2021
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Publication #:
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Pub Dt:
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09/23/2021
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Title:
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FRICTION MEMBER, FRICTION MATERIAL COMPOSITION FOR LOWER LAYER MATERIAL, LOWER LAYER MATERIAL, DISC BRAKE PAD, AND VEHICLE
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17340547
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Filing Dt:
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06/07/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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HINGE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17766011
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Filing Dt:
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04/01/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Title:
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RESIN MOLDED ARTICLE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17766448
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Filing Dt:
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04/04/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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FOAM-MOLDED PRODUCT, METHOD FOR MANUFACTURING FOAM-MOLDED PRODUCT, AND METHOD FOR SUPPRESSING APPEARANCE DEFECT OF FOAM-MOLDED PRODUCT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17766659
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Filing Dt:
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04/05/2022
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Publication #:
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Pub Dt:
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01/26/2023
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Title:
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INJECTION MOLDED PRODUCT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17788501
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Filing Dt:
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07/12/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Title:
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CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17788527
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Filing Dt:
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06/23/2022
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Publication #:
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Pub Dt:
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02/09/2023
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Title:
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SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE PROVIDED WITH SOLDER BUMP
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17981060
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Filing Dt:
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11/04/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Title:
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POLYAMIDEIMIDE RESIN COMPOSITION AND FLUORINE-CONTAINING COATING MATERIAL
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Assignee
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| 13-9, SHIBA DAIMON 1-CHOME, MINATO-KU, |
| TOKYO, JAPAN 105-8518 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, LLP
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1025 CONNECTICUT AVENUE, N.W.
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SUITE 500
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WASHINGTON, DC 20036
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