Patent Assignment Details
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| Reel/Frame: | 063189/0916 | |
| Pages: | 3 |
| | Recorded: | 03/31/2023 | | |
| Attorney Dkt #: | 010829.9655.US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17820199
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Filing Dt:
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08/16/2022
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Publication #:
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Pub Dt:
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03/02/2023
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Title:
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POLYMER COATED SEMICONDUCTOR DEVICES AND HYBRID BONDING TO FORM SEMICONDUCTOR ASSEMBLIES
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Assignee
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| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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1201 THIRD AVENUE SUITE 4900
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SEATTLE, WA 98101
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04/27/2024 08:38 PM
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